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Clark School

Professor Yuan Wang

Yuan WangVisiting Scholar from Sichuan University
Room 1223C Chemical and Nuclear Engineering
Building #090
University of Maryland, College Park, MD 20742

E-mail: wangyuan@umd.edu  |  wyuan@scu.edu.cn

 



Education

  • Ph. D. Xian Jiaotong University, 2005
  • B.S. Lanzhou University of Technology, 1993

Research Interests

  • Surface Engineering;
  • Design, characterization and reliability of nanostructured films for microelectronic device
  • Li-ion film batteries and fusion reactor
  • Surface morphology and properties of thin films

Work Experience

  • Visiting Professor, Dept of Chemical & Biomolecular Engineering, University of Maryland, 2011
  • Associate Professor, School of Physics, Sichuan University, 2007 - current
  • Research Associate, City university of Hong Kong, 2006
  • Postdoc, General Research Institute for Nonferrous Metals, 2005 - 2007

Selected Publications

  1. C. H. Liu, Y. Wang *, B. Liu, Z. An, Z. X. Song, and K. W. Xu, "Design and fabrication of ultrathin and highly thermal-stable α-Ta/graded Ta(N)/TaN multilayer as diffusion barrier for Cu interconnects", J. Phys. D: Appl. Phys, 2011, 44, 075302.
  2. X. Yin, Y. Wang *, B. Liu, X. B. Luo, "Effects of the grain boundary on phase structure and surface morphology of TiO2 films prepared by MAO technology", Surf. Interface Anal. 2011, accepted.
  3. J. J. Yang, B. Liu, Y. Wang *, K. W. Xu, "Homologous temperature dependence of global surface scaling behaviors of polycrystalline copper films", Applied Physics Letters, 2009, 95, 194104(1-3).
  4. B. Liu, J. J. Yang, C. H. Liu, Y. Wang *, "Ultrathin CuSiN/p-SiC:H bilayer capping barrier for Cu/ultralow-k dielectric integration", Applied Physics Letters, 2009, 94, 153116 (1-3).
  5. Y. Wang, P. L. Tam, Y. G. Shen, "Behavior of Ti0.5Al0.5N thin film in nanoscale deformation with different loading rates", Thin Solid Films, 2008, 516, 7641-7647.
  6. Y. Wang, Z. X. Song, Dayan Ma, Kewei Xu, "Crystalline orientation and surface structure anisotropy of annealed thin tungsten films", Surface & Coatings Technology, 2007, 201, 5518-5521
  7. Y. Wang, P. L. Tam, Y. G. Shen, "An investigation on the onset of plastic deformation of nanocrystalline solid solution Ti-Al-N films", Engineering Fracture Mechanics, 2008, 75, 4978-4984
  8. Y. Wang, X. H. Li, Y. H. Chen, K. W. Chen, "Surface morphology anisotropy and stress distribution uniformity in annealed Cu-W films", Journal of Materials Research, 2005, 20 (1), 151-160
  9. Y. Wang, K. W. Xu, "Characterization of surface morphology of copper tungsten thin film by surface fractal geometry and resistivity", Thin Solid Films, 2004, 468 (1-2), 310-315
  10. Y. Wang, X. Y. Bai, K. W. Xu, "Surface anisotropy characterization and microstructure of Cu-W thin films", Physica B: Condensed Matter, 2004, 349 (1-4), 10-18
  11. Y. Wang, Y. H. Chen, K. W. Xu, "Morphological characterization of Cu-W thin films based on wavelet transform and its application for nanoindentation hardness scattering evaluation", Journal of Korean Physical Society, 2005, 46 (5): S60-65

* Corresponding author

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